| 摘要 |
PROBLEM TO BE SOLVED: To improve a nondefective manufactured product rate of light-emitting diodes.SOLUTION: A method for manufacturing a lead frame assembly comprises a step of preparing a metal plate material. On the metal plate material, a metal outer frame and a plurality of metal lead frames are formed, and the metal outer frame and the metal lead frames are coupled with each other by a plurality of coupling parts. After the metal lead frames are electrically plated, rubber seats are formed on the metal lead frames and at a position adjacent to a hollow function area of the rubber seats, a plurality of reserved spaces leading the coupling parts to the outside are formed and the portions of the coupling parts exposed outside are cut off. Then, in the rubber seats, die bonding, wire bonding, and adhesive injection steps are performed. Finally, before adhesive is cured, power is applied to the cut-off coupling parts of the metal lead frames to light a light-emitting chip, and it is tested whether brightness and a blending ratio of chromaticity are accurate or not. |
