发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers. |
申请公布号 |
US2014027163(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201313951886 |
申请日期 |
2013.07.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MIN TAE HONG;CHO SUK HYEON;KIM JONG RIP;LEE JUNG HAN |
分类号 |
H05K1/02;H05K3/00;H05K3/10 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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