Method for manufacturing inlay for smart card, involves providing substrate with opening for receiving chip module, while integrated chip is provided to chip module with two contact areas that are spaced apart by encapsulation

摘要

The method involves providing a substrate (1) with an opening (2) for receiving a chip module, while an integrated chip is provided to the chip module with two contact areas that are spaced apart from each other by an encapsulation. An antenna with a coil of a wire (6) is attached on a surface (1.1) of the substrate, where two wire ends (6.1) are arranged traversing the opening. The wire ends are arranged so that the traversed portions (6.2) of the wire ends are spaced apart at a distance corresponding to the distance of the contact areas of the chip module. The chip module is inserted through another second surface of the substrate, while the transverse portions of the wire ends are electrically connected with the contact areas.