发明名称 |
METHOD OF HALF-CUT CUTOUT PROCESSING OF LABEL PAPER |
摘要 |
A method of half-cut cutout processing of label paper 1 is disclosed that allows laser beam 11 to cut a label sheet 3 of the label paper 1 into a given cutout shape without damaging a supporting sheet 2. In the method, a cutting locus 30 along contours of the cutout shape is printed on a surface of the label sheet 3 in a single color which is darker than or equal in darkness to a color that is the darkest of colors in portions to be cut, and then the cutting locus 30 printed is irradiated with the laser beam, thereby cutting the label sheet 3 selectively into the cutout shape. |
申请公布号 |
US2014031189(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201313946515 |
申请日期 |
2013.07.19 |
申请人 |
IZAWA HIDEO;FUJIWARA REISHI;ISHIKAWA AKIRA;MIYAKOSHI PRINTING MACHINERY CO., LTD. |
发明人 |
IZAWA HIDEO;FUJIWARA REISHI;ISHIKAWA AKIRA |
分类号 |
B31D1/02 |
主分类号 |
B31D1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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