发明名称 METHOD OF HALF-CUT CUTOUT PROCESSING OF LABEL PAPER
摘要 A method of half-cut cutout processing of label paper 1 is disclosed that allows laser beam 11 to cut a label sheet 3 of the label paper 1 into a given cutout shape without damaging a supporting sheet 2. In the method, a cutting locus 30 along contours of the cutout shape is printed on a surface of the label sheet 3 in a single color which is darker than or equal in darkness to a color that is the darkest of colors in portions to be cut, and then the cutting locus 30 printed is irradiated with the laser beam, thereby cutting the label sheet 3 selectively into the cutout shape.
申请公布号 US2014031189(A1) 申请公布日期 2014.01.30
申请号 US201313946515 申请日期 2013.07.19
申请人 IZAWA HIDEO;FUJIWARA REISHI;ISHIKAWA AKIRA;MIYAKOSHI PRINTING MACHINERY CO., LTD. 发明人 IZAWA HIDEO;FUJIWARA REISHI;ISHIKAWA AKIRA
分类号 B31D1/02 主分类号 B31D1/02
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