| 摘要 |
The present application relates to a curable composition and a use thereof. The present application can provide a curable composition having excellent producibility, workability, and adhesiveness, showing outstanding light extraction efficiency, cracking resistance, hardness, thermal shock resistance, and adhesiveness with respect to curing, and exhibiting reliable durability in severe conditions over a long time, without generating cloudiness or surface stickiness. The curable composition of the present application can be used as an adhesive material or an encapsulation of an optical semiconductor such as an LED. |
