发明名称 Linear Motion Guide Device
摘要 In a linear motion guide device suitably applicable to applications under high-temperature and vacuum environments where no plastic end cap is applicable, and having an end cap formed by injection molding using metal powders as a raw material, the degree of adhesion of the metal powders is improved at a thin and keen portion like the scooping portion of the end cap, thereby suppressing an abrasion and a deformation. The end cap (7) is formed by injection molding (MIM: Metal Injection Molding) using metal powders of equal to or less than 20 mum as a raw material, and has a scooping portion (9) having undergone an HIP (Hot-Isostatic-Pressing) process and a thermal process.
申请公布号 US2014029876(A1) 申请公布日期 2014.01.30
申请号 US201214111067 申请日期 2012.02.20
申请人 KATO SOICHIRO;SATO RYOICHI;NSK LTD 发明人 KATO SOICHIRO;SATO RYOICHI
分类号 F16C29/06 主分类号 F16C29/06
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