发明名称 |
Copper Contact Plugs with Barrier Layers |
摘要 |
A device includes a conductive layer including a bottom portion, and a sidewall portion over the bottom portion, wherein the sidewall portion is connected to an end of the bottom portion. An aluminum-containing layer overlaps the bottom portion of the conductive layer, wherein a top surface of the aluminum-containing layer is substantially level with a top edge of the sidewall portion of the conductive layer. An aluminum oxide layer is overlying the aluminum-containing layer. A copper-containing region is over the aluminum oxide layer, and is spaced apart from the aluminum-containing layer by the aluminum oxide layer. The copper-containing region is electrically coupled to the aluminum-containing layer through the top edge of the sidewall portion of the conductive layer. |
申请公布号 |
US2014027822(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201213557592 |
申请日期 |
2012.07.25 |
申请人 |
SU LI-LIN;HSIEH CHING-HUA;CHEN HUANG-MING;TSAU HSUEH WEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SU LI-LIN;HSIEH CHING-HUA;CHEN HUANG-MING;TSAU HSUEH WEN |
分类号 |
H01L23/485;H01L21/28;H01L29/78 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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