发明名称 Copper Contact Plugs with Barrier Layers
摘要 A device includes a conductive layer including a bottom portion, and a sidewall portion over the bottom portion, wherein the sidewall portion is connected to an end of the bottom portion. An aluminum-containing layer overlaps the bottom portion of the conductive layer, wherein a top surface of the aluminum-containing layer is substantially level with a top edge of the sidewall portion of the conductive layer. An aluminum oxide layer is overlying the aluminum-containing layer. A copper-containing region is over the aluminum oxide layer, and is spaced apart from the aluminum-containing layer by the aluminum oxide layer. The copper-containing region is electrically coupled to the aluminum-containing layer through the top edge of the sidewall portion of the conductive layer.
申请公布号 US2014027822(A1) 申请公布日期 2014.01.30
申请号 US201213557592 申请日期 2012.07.25
申请人 SU LI-LIN;HSIEH CHING-HUA;CHEN HUANG-MING;TSAU HSUEH WEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 SU LI-LIN;HSIEH CHING-HUA;CHEN HUANG-MING;TSAU HSUEH WEN
分类号 H01L23/485;H01L21/28;H01L29/78 主分类号 H01L23/485
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