发明名称 COLD PLATE FOR ELECTRONICS COOLING
摘要 <p>A fluid cooled cold plate can comprise a fluid output port connected near a thermally conductive base plate having a coupled heat source device, a fluid input port connected to a top surface of the cold plate, and multiple extended surface areas connected to the base plate and extending normal to the base plate. The cold plate can be configured for generally uniform fluid flow across the multiple extended surface areas. Furthermore, the multiple extended surface areas can create more resistance near a top surface of the multiple extended surface areas and less resistance near the base plate. For example, the plurality of extended surface areas can be wires that are wound near the base plate and fanned out near the top surface. An advantage of the disclosed cold plate design is the increase in heat transfer area and efficiency.</p>
申请公布号 WO2014018852(A1) 申请公布日期 2014.01.30
申请号 WO2013US52252 申请日期 2013.07.26
申请人 ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THESTATE OF ARIZONA, ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY 发明人 SHERBECK, JONATHAN
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址