| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device that can not only apply to both a metal film and an oxide film but also polish a polished film with stable polishing capabilities through whole life length of a polishing pad.SOLUTION: A polishing method for polishing a polished film of a surface of a substrate by pressing the substrate on a polishing pad on a polishing table, performs the steps of: designing previously algorithm for correction of polishing time on the basis of relation of known shrinkage of the polishing pad to polishing time required to polish the substrate by a predetermined polishing amount with a polishing pad having the polishing amount or thickness, and the predetermined polishing amount, or to a polishing amount obtained by polishing the substrate in the predetermined polishing time, and the predetermined polishing time; setting a target amount of polishing the polished film; measuring a shrinkage or thickness of the polishing pad used for polishing the film; and determining an optimum polishing time for the target polishing amount on the basis of the shrinkage or the thickness of the polishing pad measured and the algorithm so as to polish the polished film in the determined polishing time. |
