| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board with a cavity which is excellent in location accuracy between layers even in a simple process and which can achieve high density; and provide a manufacturing method of the multilayer wiring board.SOLUTION: A multilayer wiring board comprises: a core substrate A including a conductor pattern (L1) and a conductor pattern (L2) which are provided on both sides of an insulation layer A; a core substrate B including a conductor pattern (L3) and a conductor pattern (L4) which are provided on both sides of an insulation layer B; an adhesive arranged between the insulation layer A of the core substrate A on the conductor pattern (L2) side and the core substrate B on the conductor pattern (L3) side; and an opening for a cavity which pierces the insulation layer A of the core substrate A and the adhesive to reach the conductor pattern (L2) of the core substrate B. The multilayer wiring substrate further comprises: non-through vias A each piercing the conductor pattern (L1) and the insulation layer A to reach the conductor pattern (L2); and non-through vias B each piercing the conductor pattern (L4), the insulation layer B and the adhesive to reach the conductor pattern (L2). |
