发明名称 SUBSTRATE PROCESSING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate an influence of processing residues, which are an obstacle to processing, produced through thermal deformation of a substrate and unnecessary thermal diffusion.SOLUTION: A gas is blown in parallel with an optical axis movement direction of laser light, namely, to nearby processing by the laser light to blow away a processing gas and residues produced in the processing. The gas to be blown is blown in parallel with the optical axis movement direction nearby the processing by the laser light and along a processing predetermined (prediction cleavage) line to efficiently blow away the processing residues. The removed processing gas and the residues are discharged to the outside using a suction duct. Thereby, influence by residues accumulated nearby the processing part can be prevented. Even when the processing gas and the residues are produced on a back surface side of a substrate nearby the processing, they are efficiently discharged to the outside.
申请公布号 JP2014014841(A) 申请公布日期 2014.01.30
申请号 JP20120154017 申请日期 2012.07.09
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SHIMODA YUICHI
分类号 B23K26/364;B23K26/00;B23K26/142;B23K26/40;B28D5/00;C03B33/09;G02F1/13;G02F1/1333 主分类号 B23K26/364
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