发明名称 PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
摘要 There is provided a printed circuit board including: a core substrate; a solder mask selectively covering one surface of the core substrate; an open region of the solder mask including a portion of a surface of the core substrate and partitioned by the solder mask; a ball land formed on the open region of the solder mask; and a barrier formed between the ball land and the solder mask.
申请公布号 US2014027160(A1) 申请公布日期 2014.01.30
申请号 US201213619254 申请日期 2012.09.14
申请人 HONG SEOK YOON;KANG KYUNG IN 发明人 HONG SEOK YOON;KANG KYUNG IN
分类号 H05K1/09;B05D5/12;H05K1/02 主分类号 H05K1/09
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