发明名称 |
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF |
摘要 |
There is provided a printed circuit board including: a core substrate; a solder mask selectively covering one surface of the core substrate; an open region of the solder mask including a portion of a surface of the core substrate and partitioned by the solder mask; a ball land formed on the open region of the solder mask; and a barrier formed between the ball land and the solder mask. |
申请公布号 |
US2014027160(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201213619254 |
申请日期 |
2012.09.14 |
申请人 |
HONG SEOK YOON;KANG KYUNG IN |
发明人 |
HONG SEOK YOON;KANG KYUNG IN |
分类号 |
H05K1/09;B05D5/12;H05K1/02 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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