发明名称 |
THREE-DIMENSIONAL INTEGRATED CIRCUIT LAMINATE, AND INTERLAYER FILLER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT LAMINATE |
摘要 |
To provide a three-dimensional integrated circuit laminate filled in with an interlayer filler composition having both high thermal conductivity and low linear expansion property. A three-dimensional integrated circuit laminate, which comprises a semiconductor substrate laminate having at least two semiconductor substrates each having a semiconductor device layer formed thereon laminated, and has a first interlayer filler layer containing a resin (A) and an organic filler (B) and having a thermal conductivity of at least 0.8 W/(m·K) between the semiconductor substrate. |
申请公布号 |
US2014027885(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201314041341 |
申请日期 |
2013.09.30 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
KAWASE YASUHIRO;IKEMOTO MAKOTO;KIRITANI HIDEKI |
分类号 |
H01L23/532 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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