METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOINT PORTION, PRINTED WIRING BOARD WITH CONNECTING LAYER, AND SHEET-LIKE JOINT MEMBER

摘要

An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.