METHOD AND DEVICE FOR PERMANENTLY BONDING WAFERS

摘要

The present invention relates to a method for bonding a first contact area of a first substrate to a second contact area of a second substrate, wherein the second substrate has at least one reaction layer, comprising the following steps, more particularly the following sequence: receiving the substrates between a first electrode and a second electrode, or within a coil, and forming a reservoir in a reservoir-forming layer at the first contact area by exposing the first contact area to a plasma generated by means of capacitive coupling of the electrodes, wherein, during the plasma generation, a first frequency is applied to the first electrode, said first frequency being different from a second frequency of the second electrode, or plasma generated by means of inductive coupling of a coil, wherein, during the plasma generation, a first frequency is generated at the first generator, said first frequency being different from a second frequency at the second generator. The present invention additionally relates to a corresponding device.