| 摘要 |
PROBLEM TO BE SOLVED: To reduce wiring resistance of a wire which connects an output pad formed in a semiconductor element and an output terminal of an internal circuit.SOLUTION: For each of a plurality of wiring regions each formed along each side of a substrate, wiring resistance values per unit wiring length of wires formed in the respective wiring regions are made different from each other. The semiconductor element comprises, for example: a plurality of first output pads formed along one side of the outer periphery of the substrate; a plurality of second output pads formed along at least one of a side opposite to the one side and a side adjacent to the one side; and a plurality of internal circuits each of which includes an output terminal connected to any of the first and second output pads, and which are formed on the substrate along one side such that each output terminal is arranged on the one side. The wiring region includes first and second wiring regions adjacent to the first and second output pads, respectively. The wiring resistance value per unit wiring length of the wire formed in the second wiring region is lower than the wiring resistance value per unit wiring length of the wire formed in the first wiring region. |
