| 发明名称 |
POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
There is provided a power package module, including: a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component. |
| 申请公布号 |
US2014029201(A1) |
申请公布日期 |
2014.01.30 |
| 申请号 |
US201213620608 |
申请日期 |
2012.09.14 |
| 申请人 |
YANG SI JOONG;YOO DO JAE;CHAE JOON SEOK |
发明人 |
YANG SI JOONG;YOO DO JAE;CHAE JOON SEOK |
| 分类号 |
H05K7/14;H05K3/30;H05K7/20 |
主分类号 |
H05K7/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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