发明名称 |
ELASTIC MODULUS MAPPING OF A CHIP CARRIER IN A FLIP CHIP PACKAGE |
摘要 |
A computer-implemented method provides an elastic modulus map of a chip carrier of a flip chip package. Design data including dielectric and conductive design elements of each of vertically aligned sub-areas of each of the layers of the chip carrier are modeled as springs to provide the elastic modulus map. Determining the elastic modulus of the sub-areas of the chip carrier identifies probable mechanical failure sites during chip-join and cools down of the flip chip package. Modifying a footprint of solder bumps to the chip carrier reduces stresses applied to the identified probable mechanical failure sites. Modifying the chip carrier design to reduce a stiffness of sub-areas associated with identified probable mechanical failure sites also reduces stresses from chip-join and cool-down. |
申请公布号 |
US2014033148(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201213557386 |
申请日期 |
2012.07.25 |
申请人 |
COHEN ERWIN B.;LAMOREY MARK C.H.;ORLOWSKI MAREK A.;POWELL DOUGLAS O.;QUESTAD DAVID L.;STONE DAVID B.;WALLING PAUL R.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COHEN ERWIN B.;LAMOREY MARK C.H.;ORLOWSKI MAREK A.;POWELL DOUGLAS O.;QUESTAD DAVID L.;STONE DAVID B.;WALLING PAUL R. |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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