| 摘要 |
The invention describes an apparatus for testing integrated circuits by means of a scanning head (7) comprising test contacts (8). The test contacts are pressed onto electrical contacts of a substrate (6), for example of a wafer comprising integrated circuits. The apparatus has a frame (1) to which the scanning head (7) is attached, and also has a substrate support (5) for holding the substrate (6). A magnetic element generates the force with which the test contacts (8) are pressed onto the electrical contacts of the integrated circuit. At least three magnet actuators (10) are used for this purpose, each magnet actuator having an associated distance sensor (11) and being arranged around the substrate support (5) so that the distances between the magnet actuators (10) and the frame (1) and therefore between the substrate support (5) and the scanning head (7) can be adjusted by means of a controller (12). |
