发明名称 |
NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD |
摘要 |
<p>There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility.
A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.</p> |
申请公布号 |
EP2557099(A4) |
申请公布日期 |
2014.01.29 |
申请号 |
EP20110814446 |
申请日期 |
2011.07.19 |
申请人 |
DIC CORPORATION |
发明人 |
SATOU YUTAKA |
分类号 |
C08G8/28;C08G59/62;H05K1/03 |
主分类号 |
C08G8/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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