发明名称 |
ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE |
摘要 |
<p>An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190°C and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.</p> |
申请公布号 |
EP2690146(A1) |
申请公布日期 |
2014.01.29 |
申请号 |
EP20120761389 |
申请日期 |
2012.03.22 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
ISHIBA AKIHIRO;ISOBE MASATOSHI |
分类号 |
C09J7/02;H01L21/301;H01L21/683 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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