Manufacturing an semiconductor chip underfill using air vent

摘要

A method for manufacturing an underfill in a semiconductor chip stack having a cavity 4 between a first surface (2, figure 1) and a second surface (3). The cavity has multiple access 109 and vent 110 holes in at least one of the said surfaces. Viscous filling material (13) is applied through the access hole into the cavity thereby squeezing air or gas through the vent holes. The filler material may comprise of a carrier fluid 16 and filler particles 17, and be applied to the access holes by way of a dispenser tube 14. The filler material occupies the space within the cavity such that it surrounds solder balls 7. Once the filler material fills the cavity between a particular access hole and vent hole the filler material may instead be inserted through said vent hole. The vent holes may also comprise a filter element which restricts the filler particles 17 from exiting the cavity.