| 摘要 |
A thermally conductive polymer composition comprising liquid crystalline polymer; metal alloy having a melting point of between about 200° C. and about 500° C.; and thermally conductive filler other than the metal alloy. The composition has a volume resistivity of at least about 1×1013 &OHgr;·cm and a thermal conductivity of at least about 0.7 W/m·K. |
