| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of removing laser processing residues and an apparatus for removing laser processing residues with improved burr removal efficiency by bringing burrs generated by laser processing in a patterning step into contact with the tip end parts of brushes of cleaning rolls without fault and thus reliably removing the burrs. <P>SOLUTION: In the method of simultaneously removing laser processing residues adhering to the substrate in the case of patterning when a long flexible substrate 2 rolled in a roll-like state is unrolled and continuously transported and the patterning of a thin film formed on at least main face of the flexible substrate 2 is carried out by laser processing, cleaning rolls 7 using brushes in the main face side of the flexible substrate 2 are rotated and hold-down rolls 6 which are rolled while pinching the flexible substrate 2 in cooperation with the cleaning rolls 7 are installed and the brushes of the cleaning rolls 7 are operated slantingly to the transportation direction of the flexible substrate 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
