| 摘要 |
<p>A lamination having a high interface strength, in which a copper film is laminated on an aluminum substrate, or a lamination in which an aluminum film is laminated on a copper substrate, are manufactured by a cold spray method. A lamination 10 of the present invention includes: a substrate 1 formed of aluminum or aluminum alloy; an intermediate layer 2 formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate 1; and a film layer 3 formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer 2.</p> |
