| 摘要 |
The present invention relates to a method for producing microcarriers (1), the method comprising the steps of providing a wafer having a bottom layer (16), a top layer and an insulating layer (18), structuring the top layer to define at least one three-dimensional structure (7a) on the top surface of the top layer, etching away the top layer to delineate lateral walls (22) of bodies (6) of the microcarriers, applying a continuous polymer layer over the top surface (4) of the bodies (6) of the microcarriers, removing the bottom layer (16) and the insulating layer (18), structuring the bottom surfaces of the bodies (6) of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers. |
