CONDUCTIVE CUPPER PASTE COMPOSITION AND METHOD FOR FORMING METAL THIN LAYER USING THE SAME

摘要

The present invention relates to a conductive copper paste composition and a method for forming a metal thin layer using the same. The conductive copper paste composition includes back bone particles consisting of copper or copper alloy including copper and an organic copper metal compound, has improved electrical characteristics in low temperature heat treatment progress, and can suppress viscosity rise according to time.