POWER DEVICE AND POWER DEVICE MODULE

摘要

The present invention relates to a power device and a power device module and, more specifically, to a power device including an electrode to improve an electrical connection and a power device module including the same. The power device according to an embodiment of the present invention comprises: a semiconductor structure including a first surface and a second surface which face each other; an upper electrode including a first contact layer formed on the first surface and a first bonding pad layer which is formed on the first contact layer and made of metal containing nickel (Ni); and a lower electrode including a second contact layer formed on the second layer and a second boning pad layer which is formed on the second contact layer and made of metal containing nickel (Ni).