| 发明名称 |
SYSTEMS AND METHODS OF SEPARATING BONDED WAFERS |
| 摘要 |
<p>Disclosed are a system and a method of separating a bonded wafer. According to one embodiment of the present invention, the system of separating a bonded wafer includes a support part for a bonded wafer and a unit for applying a sheer force to the bonded wafer. The system further includes a unit for applying vacuum to the bonded wafer.</p> |
| 申请公布号 |
KR20140011904(A) |
申请公布日期 |
2014.01.29 |
| 申请号 |
KR20120122440 |
申请日期 |
2012.10.31 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG XIN HUA;LIU PING YIN;LIN HUNG HUA;HSIEH YUAN CHIH;CHAO LAN LIN;TSAI CHIA SHIUNG |
| 分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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