发明名称 HIGH PERFORMANCE LED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 A method of manufacturing a high-performance LED substrate includes: a metal electrode disposing step for disposing a plurality of metal electrodes being separated from each other at constant intervals; a metal electrode plate forming step for forming a metal electrode plate by inserting an insulator between the separated metal electrodes; an insulating layer forming step for forming an insulating layer on a surface of the metal electrode plate; and an LED chip mounting step for mounting an LED chip on one pair of metal electrodes. An LED substrate of the present invention is electrically connected to an LED chip, and includes: one pair of metal electrodes spaced apart from each other; a metal electrode plate including an insulator filling a space between the one pair of metal electrodes; and an insulating layer disposed on the bottom surface of the metal electrode plate to electrically separate the metal electrodes.
申请公布号 KR101356475(B1) 申请公布日期 2014.01.29
申请号 KR20130032660 申请日期 2013.03.27
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 YOO, SE HOON;LEE, CHANG WOO;KIM, JUN KI;BANG, JUNG HWAN;LEE, TAE YOUNG
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
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