| 摘要 |
A semiconductor integrated circuit includes a substrate, an oxide layer formed on an upper surface of the substrate, a plurality of polysilicon members arranged at constant intervals in a matrix on an upper surface of the oxide layer and including at least one first polysilicon member and a plurality of second polysilicon members, and a diffusion layer formed in the substrate under the first polysilicon member and electrically coupled to an interconnect for supplying a first power supply voltage, wherein the first polysilicon member is situated at an outermost periphery of the matrix and electrically coupled to an interconnect for supplying a second power supply voltage, and the plurality of second polysilicon members are situated inside the outermost periphery of the matrix. |
