发明名称 Semiconductor device and method of manufacturing semiconductor device
摘要 A high-performance semiconductor device capable of suppressing a leak current with little electric field concentration, reducing an invalid region in a PN junction region, securing a sufficient area for a Schottky junction region, and achieving efficient and easy manufacturing, in which, in one surface of a semiconductor substrate (1) having a first conduction type made of SiC, a PN junction region (7a) and a Schottky junction region (7b) are provided, in the PN junction region (7a), a convex portion (2a) which has a trapezoidal shape in sectional view and includes a second conduction type layer (2) provided on the semiconductor substrate (1) and a contact layer (3) which is in ohmic contact with the second conduction type layer (2) of the convex portion (2a) are provided, and Schottky electrode (4) covers the side surface of the convex portion (2a) and the contact layer (3), and is provided continuously over the PN junction region (7a) and the Schottky junction region (7b).
申请公布号 US8637872(B2) 申请公布日期 2014.01.28
申请号 US200913129890 申请日期 2009.10.23
申请人 SUGAI AKIHIKO;SHOWA DENKO K.K. 发明人 SUGAI AKIHIKO
分类号 H01L29/872;H01L21/329 主分类号 H01L29/872
代理机构 代理人
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