Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate

摘要

A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55@B/A@20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.