发明名称 |
System-in-a-package based flash memory card |
摘要 |
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package. |
申请公布号 |
US8637978(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US201113235781 |
申请日期 |
2011.09.19 |
申请人 |
TAKIAR HEM;MILLER ROBERT C.;MIDDLEKAUFF WARREN;PATTERSON MICHAEL W.;BHAGATH SHRIKAR;SANDISK TECHNOLOGIES INC. |
发明人 |
TAKIAR HEM;MILLER ROBERT C.;MIDDLEKAUFF WARREN;PATTERSON MICHAEL W.;BHAGATH SHRIKAR |
分类号 |
H01L23/12;H01L23/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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