发明名称 System-in-a-package based flash memory card
摘要 A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
申请公布号 US8637978(B2) 申请公布日期 2014.01.28
申请号 US201113235781 申请日期 2011.09.19
申请人 TAKIAR HEM;MILLER ROBERT C.;MIDDLEKAUFF WARREN;PATTERSON MICHAEL W.;BHAGATH SHRIKAR;SANDISK TECHNOLOGIES INC. 发明人 TAKIAR HEM;MILLER ROBERT C.;MIDDLEKAUFF WARREN;PATTERSON MICHAEL W.;BHAGATH SHRIKAR
分类号 H01L23/12;H01L23/02 主分类号 H01L23/12
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