发明名称 |
Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device |
摘要 |
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion. |
申请公布号 |
US8637965(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US201213357076 |
申请日期 |
2012.01.24 |
申请人 |
SHIMANUKI YOSHIHIKO;RENESAS ELECTRONICS CORPORATION;HITACHI YONEZAWA ELECTRONICS CO., LTD |
发明人 |
SHIMANUKI YOSHIHIKO |
分类号 |
H01L23/495;H01L21/56;H01L23/31 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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