发明名称 |
Integrated circuit package system with flex bump |
摘要 |
An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect. |
申请公布号 |
US8637394(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US20070773886 |
申请日期 |
2007.07.05 |
申请人 |
PISIGAN JAIRUS LEGASPI;BATHAN HENRY DESCALZO;TRASPORTO ARNEL;PUNZALAN JEFFREY D.;STATS CHIPPAC LTD. |
发明人 |
PISIGAN JAIRUS LEGASPI;BATHAN HENRY DESCALZO;TRASPORTO ARNEL;PUNZALAN JEFFREY D. |
分类号 |
H01L21/44;H01L23/48 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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