| 摘要 |
The present invention has no use for a measuring work of thermal resistance after a power cycle test and applies thermal stress with high density by automatically controlling a stress current and promotes the streamlining of a reliability evaluation work of IGBT. A power cycle test device is a power cycle test device which executes a power cycle test of the IGBT for test by adding thermal stress after controlling and applying the stress current to the IGBT for test. The power cycle test device applies the stress current to the IGBT for test and applies a current for measurement to the IGBT for test and measures voltage between a collector and an emitter of the IGBT for test. The power cycle test device calculates the temperature of a bonding part of the IGBT for test form the voltage between the collector and the emitter of the IGBT for test, and a temperature coefficient of the IGBT for test. [Reference numerals] (10a) U phase; (10b) V phase; (10c) W phase |
