FLUXLESS CONECTING MEMBER FOR PACKAGING OF DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a fluxless connecting member for electronic packaging without a flux coating process and a flux cleaning process using a metal solder ball where a surface oxide layer is removed. In the fluxless connecting member for electronic packaging, provided are a fluxless connecting member for electronic packaging where a TAG coating layer is formed on the surface of the connecting member, and a film for electronic packaging manufactured by the same.