发明名称 |
Integrated circuit packaging system with tiebar-less design and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a die attach pad integrally connected to a connector portion and a lead; attaching an integrated circuit die to the die attach pad; connecting an internal interconnect to the integrated circuit die and the lead; forming an encapsulation over the integrated circuit die; removing the connector portion to separate the die attach pad and the lead; and forming an isolation cover between the die attach pad and the lead. |
申请公布号 |
US8637974(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US201213523261 |
申请日期 |
2012.06.14 |
申请人 |
ZHENG ZHENG;STATS CHIPPAC LTD. |
发明人 |
ZHENG ZHENG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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