发明名称 |
Conductive pattern and manufacturing method thereof |
摘要 |
The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width. |
申请公布号 |
US8637776(B2) |
申请公布日期 |
2014.01.28 |
申请号 |
US201013148251 |
申请日期 |
2010.02.08 |
申请人 |
HWANG JI-YOUNG;HWANG IN-SEOK;LEE DONG-WOOK;PARK MIN-CHOON;LEE SEUNG-HEON;CHUN SANG-KI;SON YONG-KOO;KOO BEOM-MO;LG CHEM, LTD. |
发明人 |
HWANG JI-YOUNG;HWANG IN-SEOK;LEE DONG-WOOK;PARK MIN-CHOON;LEE SEUNG-HEON;CHUN SANG-KI;SON YONG-KOO;KOO BEOM-MO |
分类号 |
H05K1/00;H05K1/03;H05K1/09 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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