发明名称 SEMICONDUCTOR MANUFACTURING FACILITY FOR ASSEMBLY OF THE PIPING CLOSE CONTACT PAD
摘要 The present invention relates to a new structure of a high efficiency contact pad, capable of guaranteeing excellent contact properties, chemical resistance properties, and insulation properties as well as excellent air tightness properties (preventing a leakage and preventing foreign substances from being permeated) required when flanges connecting pipes used in semiconductor manufacturing facilities and other pipes are combined. In a conventional contact pad (A) for assembling pipes, a fluid passing groove is formed on the center thereof similar to a washer or a doughnut; a ring-shaped pad (110) including a fixed thickness or width is installed on the outer circumference; a non asbestos material (120), which is flexible, soft, and strong, is embedded in the ring-shaped pad (110); and a PTFE (Teflons) outer cover (130) including excellent durability, chemical resistance properties, and oil resistance properties and low friction coefficient is formed on the surface of the non-asbestos material (120). One or more bolt support units (200) are additionally protruding from the outer circumference of the ring-shaped pad (110) in order to prevent a fastening bolt from being leant to one side even if there is sudden temperature change, vibration, or impact by easily inserting the fastening bolt (20) into flanges when the fastening bolt (20) is fastened to connect the flanges (10).
申请公布号 KR101354900(B1) 申请公布日期 2014.01.27
申请号 KR20130078205 申请日期 2013.07.04
申请人 FLUORO TECH CO., LTD. 发明人 SEO, BO KYU
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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