| 摘要 |
<p>A stack package of the present invention includes a first semiconductor chip and a second semiconductor chip which are stacked on a substrate, the first semiconductor chip including first I/O pads in/from which data I/O signals are input/output, a first flag pad for receiving a flag signal, and a first buffer unit for switching transmission of the data I/O signals in the first semiconductor chip, the second semiconductor chip including second I/O pads in/from which the data I/O signals are input/output, a second flag pad for receiving the flag signal, and a second buffer unit for switching transmission of the data I/O signals in the a second semiconductor chip. The first I/O pads and the second I/O pads are commonly connected by first wires, and the first flag pad and the second flag pad are commonly connected by a second wire.</p> |
