MULTI-LAYER FILM STRUCTURE AND BLISTER PACKAGE MADE FROM IT

摘要

A multi-layer film structure (10) for use in forming blister packaging includes a first polymeric layer (12) having a first surface (14) and a second surface (16), the first polymeric layer (12) comprising a metalized polyethylene teraphthalate. The multi-layer structure (10) also includes a second polymeric layer (24) having a first surface (26) and a second surface (28), the first surface (26) of the second polymeric layer (24) disposed adjacent the second surface (16) of the first polymeric layer (12), the second polymeric layer (24) comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene. The multi-layer structure (10) further includes a third polymeric layer (36) having a first surface (38) and a second surface (40), the first surface (38) of the third polymeric layer (36) disposed adjacent the second surface (28) of the second polymeric layer (24), the third polymeric layer (36) comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure (10) and a thermoformed blister package (100) are also provided.