Electronic component e.g. semiconductor component has heat sink that is provided between attachment portions to produce working contact pressure

摘要

The electronic component has a printed circuit board (PCB) (1) that is provided with a fastening element and with first side. The PCB is arranged with a heat-generating portion (2) and a heat sink (11) with second fastening element (12). A securing portion and a second attachment portion are provided with a magnet. The heat sink is provided between the attachment portions to produce the working contact pressure (F).