发明名称 CHIP DEVICE, MULTI-LAYERED CHIP DEVICE AND METHOD OF PRODUCING THE SAME
摘要 There is provided a multi-layered chip device, including: a multi-layered body in which a plurality of inner magnetic layers are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes formed on outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, wherein a length of the outer magnetic layer is shorter than the inner magnetic layer.
申请公布号 US2014022042(A1) 申请公布日期 2014.01.23
申请号 US201313740738 申请日期 2013.01.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK SANG SOO;AHN YOUNG GHYU;PARK MIN CHEOL
分类号 H01F17/00;H01F41/00 主分类号 H01F17/00
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