发明名称 |
CHIP DEVICE, MULTI-LAYERED CHIP DEVICE AND METHOD OF PRODUCING THE SAME |
摘要 |
There is provided a multi-layered chip device, including: a multi-layered body in which a plurality of inner magnetic layers are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes formed on outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, wherein a length of the outer magnetic layer is shorter than the inner magnetic layer. |
申请公布号 |
US2014022042(A1) |
申请公布日期 |
2014.01.23 |
申请号 |
US201313740738 |
申请日期 |
2013.01.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK SANG SOO;AHN YOUNG GHYU;PARK MIN CHEOL |
分类号 |
H01F17/00;H01F41/00 |
主分类号 |
H01F17/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|