| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive fine particles that can satisfactorily lower electric resistance of a connection site when being used for thermal press-bonding connection, and can improve persistence thereof.SOLUTION: A conductive fine particle includes: a mother particle; non-conductive crosslinked resin child particles formed on a surface of the mother particle; and a metal coat layer that coats surfaces of them. A loss factor tanδ that expresses a ratio of a loss elastic modulus to a storage elastic modulus by dynamic viscoelasticity measurement of the crosslinked resin child particle is 0.1-1.0 at a temperature in a region of 120-180°C and is preferably is 0.1-0.5. Moreover, the crosslinked resin child particle is set that a crosslinking density is at most 1.5×10mol/cm. Further, the crosslinked resin child particle is made of a crosslinked polymer, and the crosslinked polymer is preferably formed by a monomer having a long-chain structure. |
