| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can inhibit lead frame warpage and peeling of an encapsulation resin without separately preparing an insulator for thermally connecting the package and the outside.SOLUTION: In a semiconductor package S1, a semiconductor element 20 is mounted on one surface 11 of a lead frame 10, and the lead frame 10 and the semiconductor element 20 are encapsulated by an encapsulation resin 30 with the other surface 12 of the lead frame 10 being exposed. An electrically insulating insulation film 50, which has larger adhesion with the encapsulation resin 30 than that with the lead frame 10 and is composed of ceramic, is provided at a part covered with the encapsulation resin 30 among surfaces 11-13 of the lead frame 10. The insulation film 50 is also provided on the other surface 12 of the lead frame 10 to cover the other surface 12. A metal film 60 is provided on a surface of the insulation film 50 covering the other surface 12 and is exposed from the encapsulation resin 30. |
