| 摘要 |
Apparatus and methods for removing unwanted heat generated by apparatus such as personal computer systems and other appliances. The apparatus comprising a thermally conductive surface to which heat from heat-generating components is communicated via a heat transmitting means such as a heatpipe. The apparatus can then be cooled by contacting cooling apparatus to the thermally conductive surface. Also described are liquid cooling apparatus suitable for contacting to apparatus having thermally conductive surfaces and a method for cooling a plurality of computer systems. |
