发明名称 HOT SIDE MANAGEMENT OF THERMOELECTRIC COOLING MODULE
摘要 A thermoelectric cooling system includes a hot side that includes a first temperature. A cold side, in relation to the hot side, within the thermoelectric cooling system, is configured to accept a cooling load. Further, an ambient region configured around the hot side includes an ambient temperature as well. In particular, the system includes a mechanism, configured to be in engagement with the thermoelectric cooling system, and adapted to keep the first temperature of the hot side below the ambient temperature at all times, aiming to increase a cooling capacity of the thermoelectric cooling system.
申请公布号 WO2013153518(A3) 申请公布日期 2014.01.23
申请号 WO2013IB52843 申请日期 2013.04.10
申请人 THE CONCENTRATE MANUFACTURING COMPANY OF IRELAND 发明人 SUBRAMANIAM, PRADIP;BALUJA, GIRISH;VATS, TANMAYA;SOOD, ASHISH;DEWANG, PARIKH
分类号 F25B21/02;H01L23/02 主分类号 F25B21/02
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