| 摘要 |
<p>Disclosed is a method for bending semiconductor module terminals, whereby variance of height of the semiconductor module terminals due to tilting of the terminals is reduced, said terminals having been formed by bending. A housing and a terminal are prepared, said housing being provided with a through hole, a first supporting point formed at an opening of the through hole, and a second supporting point formed at a position further from the through hole than the first supporting point. The terminal that has passed through the through hole is bent with the first supporting point as a supporting point. With the second supporting point as a supporting point, the terminal is bent until the terminal is substantially parallel to the main surface of the housing. Furthermore, with the second supporting point as a supporting point, the terminal is bent such that an end portion of the terminal is displaced toward the main surface of the housing by at least a length equivalent to the thickness of the terminal.</p> |
